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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Mentor Video: Sharing Data Throughout the Lifecycle with EDX
July 11, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
The Xpedition EDM data management suite of tools is designed to provide seamless integration between engineering and external PLM and ERP systems across the enterprise. This integration utilizes the Enterprise Data eXchange (EDX) data format to share data throughout the product lifecycle.
EDX captures and protects your EDA data in one package for secure data exchange and simplified process integration. EDX enables a robust and stable interface independent of releases and internal tool database structures.
To view this video from Mentor, a Siemens business, click here.
Suggested Items
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Smart Automation: The Power of Data Integration in Electronics Manufacturing
06/24/2025 | Josh Casper -- Column: Smart AutomationAs EMS companies adopt automation, machine data collection and integration are among the biggest challenges. It’s now commonplace for equipment to collect and output vast amounts of data, sometimes more than a manufacturer knows what to do with. While many OEM equipment vendors offer full-line solutions, most EMS companies still take a vendor-agnostic approach, selecting the equipment companies that best serve their needs rather than a single-vendor solution.
Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
06/17/2025 | Keysight TechnologiesKeysight Technologies, Inc. in collaboration with NTT Corporation and NTT Innovative Devices Corporation (NTT Innovative Devices), today announced a groundbreaking world record in data rate achieved using sub-THz frequencies.
Priority Software Announces the New, Game-Changing aiERP
06/12/2025 | Priority SoftwarePriority Software Ltd., a leading global provider of ERP and business management software announces its revolutionary aiERP, leveraging the power of AI to transform business operations.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.