Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Cogiscan and Saki Announce Strategic Partnership
July 15, 2019 | Saki CorporationEstimated reading time: 2 minutes
Cogiscan Inc. has partnered with Saki Corporation to expand Saki’s manufacturing software solutions offering. Saki’s solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) software, in combination with Cogiscan’s TTC solutions, will speed the development of Smart Factory Solutions. Saki Corporation, Tokyo, Japan, is a worldwide leader in the field of automated visual inspection equipment for the printed circuit board assembly market.
This partnership will drive the development of new software products that will enable SAKI customers to recognize and solve manufacturing issues more quickly, while embracing a data-driven approach to continuous improvement. The end result will be enhanced productivity and quality through smarter manufacturing.
“We are pleased to announce our partnership with Cogiscan,” said Norihiro Koike, president at Saki Corporation, “Cogiscan plays a major role in the SMT world with its universal connectivity technology and high data-handling capability. The Smart Factory is becoming more prevalent in the SMT market, making storage and handling of huge amounts of inspection data even more essential. Our collaboration with Cogiscan helps accelerate the development of the Smart Factory, enabling us to take technology to the next level and fostering success for our customers.”
Mitch DeCaire, global director – equipment partnerships at Cogiscan, added, “Cogiscan is thrilled and honored to collaborate with a global leader like Saki. We appreciate the opportunity to play a role in their evolution and look forward to diligently serving Saki and its customers for many years to come."
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan with offices, sales, and support centers around the world. For more information www.sakiglobal.com .
About Cogiscan Inc.
Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry. The scalable Cogiscan platform perfectly integrates with all major equipment types and is highly configurable to enable a personalized solution to each customer’s specific production needs. Since 1999 Cogiscan has attained several international patents for TTC hardware and software and has won multiple awards throughout the years. For more information, visit www.cogiscan.com.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.