Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019
July 17, 2019 | YINCAE Advanced MaterialsEstimated reading time: 1 minute
YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1-2, 2019.
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics. YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications. YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications. YINCAE underfills not only offer high thermal conductivity and high Tg (245degC) but also can be used at over 400degC.
About YINCAE Advanced Materials
Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
Share on:
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.