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High Density Packaging (HDP) User Group is pleased to announce that Gen3 has become our newest member.
“We are very pleased to be the newest member of the HDP User Group and are keen to bring our knowhow to the two ongoing CAF projects. We feel that Gen3’s expert knowledge in the contamination and solderability fields of electronics reliability testing, and the development of the respective international standards, will be a great addition to this existing group’s substantial depth of knowledge of the electronics manufacturing industry and the challenges it faces,” said Emma Hudson, CTO at Gen3.
“It is an honor and a privilege to have Gen3 join the outstanding companies working on HDP User Group projects. Their expertise and capability in reliability testing and failure analysis will be a vital addition to the combined capabilities of our members,” said Marshall Andrews, executive director of HDP User Group.
About HDP User Group
HDP User Group is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin Texas, and Singapore.
