-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Launches IndiOx
August 7, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has released IndiOx (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx (In2O3) is a stable ceramic-like material that is insoluble in water and volatizes at 850°C.
When doped with tin oxide, IndiOx forms ITO, the material of choice to form transparent conductive oxide (TCO) layers in flat-panel displays and touch sensors for mobile devices. The ITO layer is deposited onto glass from a sputtering target that is manufactured from the ITO powder by sintering.
Other uses for IndiOx include glass coloring, gassing suppression in alkaline batteries, and as an anti-arcing additive in high current electrical switches and contactors.
IndiOx is available in three powder types:
- Type A – Crystalline: particle size distribution D10–D90 ranges from 0.8–38μm.
- Type B – Fine: particle size distribution D10–D90 ranges from 0.5–6μm.
- Type T – Target Grade: particle size distribution D10–D90 ranges from 0.1–7.5μm. The primary particle size is about 100nm.
About Indium
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Suggested Items
Indium Corporation Receives Business/Industry Partnership Award by NYCCT
11/06/2024 | Indium CorporationIndium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees (NYCCT).
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Indium Experts to Present at International Electronics Manufacturing Technology Conference
10/15/2024 | Indium CorporationIndium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Indium Experts to Present Advanced Research at International Symposium on Microelectronics
09/20/2024 | IndiumIndium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.