-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
NextFlex’s Technology Hub Complies with FDA Standards for Manufacturing of Medical Devices
August 8, 2019 | Business WireEstimated reading time: 2 minutes
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, has announced that its Technology Hub’s fabrication facility in San Jose now complies with FDA manufacturing standards for medical devices.
NextFlex’s Quality System adheres to the intent of the Food and Drug Administration’s (FDA) regulations for good manufacturing practices. All medical device products and components produced at the NextFlex facility will be manufactured consistently to meet Quality System Regulations (QSR) requirements.
“The NextFlex Technology Hub has come a long way in a short time and is now FDA-compliant for the manufacture of medical devices. We follow current good manufacturing practices in order to meet the strict requirements of the FDA,” said Art Wall, director of Fab Operations at NextFlex. “NextFlex is now in a position to support the goals of medical device manufacturers by implementing the QS regulation known as 21 CFR Part 820. This quality framework assures customers that the devices that NextFlex produces are fully compliant with current applicable regulations.”
As part of its mission to advanced FHE manufacturing in the U.S., NextFlex’s facility has two cleanrooms for printing, device integration and lab space for testing and measurement, with a greater collection of FHE print capability under one roof than anywhere else in the world. With all medical devices produced at this facility now FDA-compliant, both large companies and startups alike can fill the gap between prototyping and full-scale manufacturing in a low-risk, cost-efficient way by using NextFlex’s full complement of FHE design, development and manufacturing services.
About NextFlex
NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network of institutes. Formed through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex’s elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems.
About Flexible Hybrid Electronics (FHE)
FHE gives everyday products the power of silicon ICs by combining them with new and unique printing processes and new materials. The result: lightweight, low-cost, flexible, conformable, stretchable and highly efficient smart products with innumerable uses for consumer, commercial and military applications.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
Celestica Provides Update on New Operations in Fort Worth, Texas
05/15/2026 | CelesticaCelestica Inc. a global leader in data center infrastructure and advanced technology solutions, provided an update on its plans to establish operations in AllianceTexas in Fort Worth, Texas.
Cirtronics Brings Commercialization Discussion to Robotics Summit & Expo 2026
05/14/2026 | CirtronicsCirtronics, a leading electronics contract manufacturer specializing in complex robotics systems, will sponsor and lead a featured panel discussion at the 2026 Robotics Summit & Expo, taking place May 27–28 at the Thomas M. Menino Convention & Exhibition Center in Boston.
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.
Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit
05/14/2026 | SIAThe Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.