Smart Automation: When It’s Time to Replace SMT Equipment
Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
AIM’s Flopy Feng to Present at SMTA China South Technical Conference
August 13, 2019 | AIMEstimated reading time: 1 minute
AIM Solder has announced that Flopy Feng will present at the 2019 SMTA China South Technical Conference at the Shenzhen Convention & Exhibition Center in Shenzen, China. Flopy’s presentation, “An Update on High Reliability Lead-Free Solder Alloys,” is scheduled for Thursday, August 29, 2019 from 14:55-15:30.
The presentation will cover the effects—environmental, thermal cycling and mechanical—on the functionality of electronic devices. The shortcoming of SAC alloys will be reviewed and how novel multicomponent solder alloys can be a good solution for harsh and demanding applications.
About the Presenter
Flopy Feng is a Technical Support Manager for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over 15 years of experience in the SMT industry, Flopy supports AIM customers in south China.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025
12/11/2025 | Indium CorporationIndium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India.
Nordson Rolls Out New Feature for Auto Sector
12/09/2025 | Nolan Johnson, SMT007 MagazineAn ever-widening variety of components and denser board features are creating a gap for new equipment. Just as stencils are moving to multi-thickness panels for complex applications, soldering hardware is evolving to become more precise and integrated into the entire manufacturing line. Jeanine Norlin and Roberta Foster-Smith, representatives of Nordson Electronics Solutions, discuss the current state and implications of selective soldering, including a case study of a customer that made a change. How will selective soldering fit into your future?
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.