Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Rehm Thermal Systems to Present Product Portfolio at Important Asian Trade Fairs
August 14, 2019 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Some of the most important trade fairs in the electronics sector will be taking place in Asia in the next few weeks: Nepcon South China (Shenzhen), Nepcon Vietnam, and Semicon Taiwan. Rehm Thermal Systems will also be exhibiting its product portfolio at these trade fairs and introducing visitors to Rehm’s new developments and innovations in system and process technologies. Attendees will also be able to talk to the Rehm team at the events.
First up is Nepcon South China, from 28th to 30th August at the Shenzhen Convention & Exhibition Centre in Shenzhen. At Stand 1J55 Rehm Thermal Systems will present the VisionXP+ Vac convection soldering system. This system can reliably eliminate pores, gas cavities and voids in a vacuum chamber directly after the soldering process whilst the soldering material is still in an optimum melted state. The CondensoXC condensation soldering system and the ProtectoXC coating system will also be presented at Nepcon South China. The CondensoXC is a space-saving, high-performance vapour-phase system for laboratory applications, small-batch production, or prototyping. The ProtectoXC is ideal for coating small batch sizes and is also suitable for production environments thanks to its small footprint.
Nepcon Vietnam will open its doors to trade fair visitors from 11th to 13th September. The Rehm team looks forward to welcoming you to I.C.E. Hanoi (Cung Van Hoa) at Stand I14. We will be able to discuss the latest trends and innovations in the electronics sector with you at the stand and share our experiences. From 18th to 20th September, Rehm Thermal Systems will be sharing a stand with the Taiwanese distributor Titan-Semi Co. Ltd. at Semicon Taiwan in the Nangang Exhibition Centre in Taipeh. The stand number will be K2268. At Semicon Taiwan, Rehm will be presenting the VisionX Semico 834 convection soldering system, which has been specially designed for semiconductors. The VisionX Semico is based on the proven VisionX series, which has been successfully established in the reflow soldering market for years. The optimal heat transfer through specially developed nozzle fields ensures a small delta T and thus the best process performance. The low-vibration transport, whether as braided belt, pin chain, combination transport or as single or dual lane, meets the high demands of semiconductor production and ensures additional process reliability.
About Rehm Thermal Systems
As an expert in the field of thermal systems for the electronics and photovoltaics industry, Rehm is one of the leaders in terms of technology and innovation in the modern and cost-efficient production of electronic assemblies. As a global manufacturer of reflow soldering systems with convection, condensation or vacuum technology, drying or coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customer-specific special installations, we are represented in all the relevant growth markets. As a partner with almost 30 years of experience in this industry, we implement innovative production solutions that set standards.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.