-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Thermal Systems to Present Product Portfolio at Important Asian Trade Fairs
August 14, 2019 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Some of the most important trade fairs in the electronics sector will be taking place in Asia in the next few weeks: Nepcon South China (Shenzhen), Nepcon Vietnam, and Semicon Taiwan. Rehm Thermal Systems will also be exhibiting its product portfolio at these trade fairs and introducing visitors to Rehm’s new developments and innovations in system and process technologies. Attendees will also be able to talk to the Rehm team at the events.
First up is Nepcon South China, from 28th to 30th August at the Shenzhen Convention & Exhibition Centre in Shenzhen. At Stand 1J55 Rehm Thermal Systems will present the VisionXP+ Vac convection soldering system. This system can reliably eliminate pores, gas cavities and voids in a vacuum chamber directly after the soldering process whilst the soldering material is still in an optimum melted state. The CondensoXC condensation soldering system and the ProtectoXC coating system will also be presented at Nepcon South China. The CondensoXC is a space-saving, high-performance vapour-phase system for laboratory applications, small-batch production, or prototyping. The ProtectoXC is ideal for coating small batch sizes and is also suitable for production environments thanks to its small footprint.
Nepcon Vietnam will open its doors to trade fair visitors from 11th to 13th September. The Rehm team looks forward to welcoming you to I.C.E. Hanoi (Cung Van Hoa) at Stand I14. We will be able to discuss the latest trends and innovations in the electronics sector with you at the stand and share our experiences. From 18th to 20th September, Rehm Thermal Systems will be sharing a stand with the Taiwanese distributor Titan-Semi Co. Ltd. at Semicon Taiwan in the Nangang Exhibition Centre in Taipeh. The stand number will be K2268. At Semicon Taiwan, Rehm will be presenting the VisionX Semico 834 convection soldering system, which has been specially designed for semiconductors. The VisionX Semico is based on the proven VisionX series, which has been successfully established in the reflow soldering market for years. The optimal heat transfer through specially developed nozzle fields ensures a small delta T and thus the best process performance. The low-vibration transport, whether as braided belt, pin chain, combination transport or as single or dual lane, meets the high demands of semiconductor production and ensures additional process reliability.
About Rehm Thermal Systems
As an expert in the field of thermal systems for the electronics and photovoltaics industry, Rehm is one of the leaders in terms of technology and innovation in the modern and cost-efficient production of electronic assemblies. As a global manufacturer of reflow soldering systems with convection, condensation or vacuum technology, drying or coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customer-specific special installations, we are represented in all the relevant growth markets. As a partner with almost 30 years of experience in this industry, we implement innovative production solutions that set standards.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.