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DuPont to Introduce Advanced Kalrez Sealing Innovations for Semiconductor Manufacturing at SEMICON Southeast Asia

05/15/2025 | DuPont
DuPont is excited to announce its participation in SEMICON Southeast Asia (SEMICON SEA), taking place May 20-22, 2025, in Singapore. At booth L3105,

Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand

05/13/2025 | Prashant Patel -- Column: Facing the Future
Innovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.

ZenaTech’s ZenaDrone Tests Proprietary Camera Enabling IQ Nano Drone Swarms for US Defense Applications, Blue UAS Submission

05/09/2025 | Globe Newswire
ZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), enterprise SaaS, and Quantum Computing solutions, announces that its subsidiary ZenaDrone is testing a new proprietary specialized camera that enables more efficient indoor applications such as inventory and security management, when utilizing IQ Nano drone swarms for commercial and US defense applications.

Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications

05/05/2025 | Elma Electronic
Elma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.

'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025

05/02/2025 | TopLine
Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
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