-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Dynamic Electronics Confirms Reports of Layoffs
August 27, 2019 | I-Connect007Estimated reading time: Less than a minute
Dynamic Electronics Co. Ltd, one of the leading providers of PCBs in Taiwan, was recently reported to be laying off more than 400 of its employees.
In a statement released to the Taiwan Stock Exchange, Dynamic confirms the layoffs, saying that it is being carried out to improve the company's overall competitiveness since the global economy turned weak this year due to the impact of the US-China trade war.
In conjunction with the group's production line consolidation, Dynamic said it plans to transfer the production capacity of the Taoyuan Plant to its overseas factories. The Taoyuan Operation Headquarters will be fully devoted to R&D, product technical services and group orders.
To accommodate this restructuring, the staff will be retained in the operation headquarters according to the nature of the job, be assigned to the overseas factory, or be arranged according to their own career planning. The company will also engage with the industry to refer employees for possible employment.
On August 15, the company notified the Department of Labor regarding its layoffs. The matter will be handled in accordance with the relevant laws and regulations.
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility
11/25/2024 | CILIn early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
11/22/2024 | Real Time with... electronicaMarcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.