Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
Enhancing Materials for Hi-Res Patterning to Advance Microelectronics
August 29, 2019 | Brookhaven National LaboratoryEstimated reading time: 5 minutes
Going forward, the team will study how the hybrid resists respond to EUV exposure. They have already started using soft x-rays (energy range corresponding to the wavelength of EUV light) at Brookhaven’s National Synchrotron Light Source II (NSLS-II), and hope to use a dedicated EUV beamline operated by the Center for X-ray Optics at Lawrence Berkeley National Lab’s Advanced Light Source (ALS) in collaboration with industry partners.
“The energy absorption by the organic layer of EUVL resists is very weak,” said Nam. “Adding inorganic elements, such as tin or zirconium, can make them more sensitive to EUV light. We look forward to exploring how our approach can address the resist performance requirements of EUVL.”
Both NSLS-II and ALS are DOE Office of Science User Facilities. The other co-authors are CFN scientists Kim Kisslinger, Ming Lu, and Aaron Stein; and Ashwanth Subramanian, a PhD student in the Department of Materials Science and Chemical Engineering at Stony Brook University and a graduate research assistant at the CFN.
About Brookhaven National Laboratory
Brookhaven National Laboratory is supported by the U.S. Department of Energy’s Office of Science. The Office of Science is the single largest supporter of basic research in the physical sciences in the United States and is working to address some of the most pressing challenges of our time. For more information, visit https://energy.gov/science.
Page 3 of 3Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
PCBAA Sets Its Priorities for 2026: Support in the House and Senate
02/03/2026 | Marcy LaRont, I-Connect007David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In the continuation of this interview, David talks about the ways his organization is aligning its priorities with Washington, in particular, the Executive Branch. It might feel like a snail’s pace, but progress could mean financial support and more domestic security, even for the smaller companies.
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
10/07/2025 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsData is one of the six pillars of AI infrastructure. It is critical to the performance of artificial intelligence (AI) models. AI data, essential to both the training and inference of Generative AI models, connotes the datasets used to train, validate, and test AI models. Training data provides models with a frame of reference by establishing a baseline against which models can compare new data using pre-trained models for predictions or generating new content.
U.S. Uses Secret Trackers to Trace AI Chips Diverted to China, Sources Say
08/18/2025 | I-Connect007 Editorial TeamTwo sources told Reuters that U.S. authorities have secretly placed location trackers in some advanced chip shipments they see as at high risk of illegal diversion to China. They said the trackers are intended to locate AI chips that are sent to locations restricted by U.S. export laws, but authorities only examine some shipments.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.