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High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Airbus, European Partners Demonstrate Collaboration Between Helicopters and Unmanned Systems

10/14/2024 | Airbus
Airbus Helicopters and its partners have conducted a full scale demonstration of a manned-unmanned teaming (MUM-T) system developed as part of a project funded by the European Union and code-named MUSHER.

Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years

09/30/2024 | SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2027 report.

SIA Applauds Finalization of First CHIPS Award for Polar Semiconductor

09/30/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act.

Altair Joins £5.8M PIVOT Project to Revolutionize Sustainable Vehicle Manufacturing

09/27/2024 | Altair
Altair, a global leader in computational intelligence, has announced its involvement in the £5.8 million Performance Integrated Vehicle Optimization Technology (PIVOT) project, supported by Innovate UK and the Advanced Propulsion Centre (APC).
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