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Miva Technologies Releases 2000RR: 10-micron Capable Reel-to-Reel Direct Imaging System
August 30, 2019 | Miva TechnologiesEstimated reading time: 1 minute
Chris Hrusovsky, MivaTek global vice president of business development, is excited to announce the company installed its first reel-to-reel, flexible circuit capable, 10-micron direct imaging system. The system was designed based on their patented quad-wave DLP direct write technology at a high-volume manufacturer of precision technologies in the Central USA.
Combined with efforts from local sales team at Integrated Process Technologies, MivaTek Global collaborated with the customer to develop the new product further expanding Miva’s microelectronics offering.
About Miva Technologies
Miva Technologies, GmbH is a leading producer of direct imaging and direct write technologies for the printed circuit, microelectronics and chemical milling markets. Based in Stuttgart, Germany Miva Technologies, GmbH has global distribution and support for its leading LED imaging technologies. (www.mivatec.com)
About MivaTek Global, LLC
MivaTek Global, LLC is Miva’s business and application development arm based outside of Philadelphia, PA. (www.MivaTek.global)
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SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.