Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
In Memoriam: Thomas Gardeski
September 5, 2019 | John Perry, IPCEstimated reading time: 1 minute
It is with deep sadness that IPC announces the passing of one of its valued and storied committee members and leaders, Thomas Frank Gardeski, president of Gemini Sciences, LLC. Tom passed away on July 28, 2019.
Over the course of his career, Thomas furthered the advancement of flexible circuit, chip scale package (CSP) and high density interconnect (HDI) technology while at Sheldahl, 3M, DuPont and finally his own company, Gemini Sciences, LLC.
Thomas joined several IPC standards development task groups in 1999 related to flexible and rigid-flexible printed board technology. In 2003 Thomas assumed the chair position of the IPC D-10 Flexible Circuits Committee. In doing so, Thomas led and supported numerous efforts to develop and revise such IPC standards as IPC-2223 for flexible circuit design, the IPC-420X series for flexible materials performance, IPC-6013 for flexible printed board performance and the various IPC-TM-650 Test Methods related to these documents.
Outside of work, Thomas was a 9th degree Black Belt and was inducted into the International Martial Arts Hall of Fame in 2003. Thomas was also an expert-level big wave surfer and was known to surf at the legendary Banzai Pipeline in Oahu, Hawaii.
His energy, enthusiasm and valuable contributions to the industry will be missed by many. On behalf of the electronics industry, IPC offers its condolences to Thomas’ wife Carole Ann Gardeski and their family.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.