-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TopLine Revealing 'Stress Relief' Solutions at SMTAI
September 5, 2019 | TopLineEstimated reading time: 1 minute

Stress isn’t good for anyone, and it certainly isn’t good for SMT/PCBAs, especially when it’s caused by a large Coefficient of Thermal Expansion (CTE) mismatch, says Martin Hart, CEO of TopLine Corporation. That’s why TopLine technical staff will be on hand to discuss solutions for mitigating stress in large heterogeneous modules at the upcoming SMTAI 2019 Conference and Expo in Rosemont, Illinois September 24-25, 2019, in booth #832.
“CTE mismatch results from packaging different materials, with their own CTE properties inside of one package,” Hart says. “This creates tremendous stress when these packages thermally cycle. Materials want to go in different directions at different rates. If the stress can’t be absorbed, the package might fail, and that’s not good for mission-critical parts in Military and Aerospace systems.”
Solutions include using cylindrically-shaped solder columns to absorb CTE mismatch rather than solder balls (as in (Ball Grid Arrays, or BGAs), which have limited ability to withstand environments where there may be wide temperature swings.
“Solder balls have a tendency to crack; whereas solder columns are compliant and can withstand stretching and pulling between modules and the PC board,” Hart says. So TopLine will exhibit CCGA - Column Grid Arrays which are made with non-collapsible high-temperature solder columns for soldering onto PCBs. CCGA packages provide more compliancy than BGA solder balls to absorb stress caused by CTE mismatch.
About TopLine
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Suggested Items
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).