-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki to Demonstrate 3D AOI and 3D AXI Off-line Programming Live at SMTAI
September 10, 2019 | Saki CorporationEstimated reading time: 1 minute

Saki Corporation will present its 3D automated optical inspection (AOI) system and BFX-Editor automated x-ray inspection (AXI) off-line programming and debugging software at SMTA International in booth 430.
Saki's 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system resulting in accuracy, stability, and reliability. It comes with the newly released Saki Self-Programming (SSP) software, which doesn't require programming or a golden board and, in a matter of minutes, completely programs and verifies the inspection process in real time, eliminating variables and operator error. SSP software makes inspection faster and easier, especially for EMS companies with high-mix, low-volume environments such as NPI. Visitors to the Saki booth will be able to see a live demo of Saki's latest 3D-AOI system and this new self-programming function.
In addition to its 3D-AOI software, Saki will introduce its x-ray programming system for its inline 3D AXI volumetric measurement and inspection system. The system identifies and classifies defects, including 100% of head-in-pillow defects, voids, and dry joints, and enables land grid array (LGA) inspection and measurement. Its off-line programming and debugging software, the BFX-Editor, lets you create, edit, and debug inspection programs on your PC and generates inspection data prior to production.
Saki has a complete line of automated inspection equipment, including 2D AOI, 2D bottom-side AOI, and 3D SPI, AOI, and AXI systems. Built on the foundation of Quality Driven Production (QDP), which is based on quality, reliability, consistency, and ease of use, Saki's systems are used to inspect electronic assemblies that operate in high-reliability environments like medical, automotive, and aerospace where failure is not an option.
SMTA International is being held at the Donald Stephens Convention Center, Rosemont, Illinois on September 24 and 25, 2019.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.