-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Brigitflex Invests in New Excellon Drilling/Routing System
September 11, 2019 | ExcellonEstimated reading time: 2 minutes
Excellon announces the installation of a model 154L vision drill/routing system at Brigitflex, Inc. of Elgin, Illinois, U.S.A.
The Excellon 154L vision drill/routing system offers high speed axis positioning via linear motor technology making quick work of large panel PCB’s up to 54 by 30 inches. The vision system provides capabilities such as drilling/routing relative to surface targets and features ensuring high accuracy and precise hole placement. This capability is especially important when working with thin materials, kapton, microwave and teflon substrates, that grow or shrink during the manufacturing process. The 154L is equipped with tight tolerance depth to +/- 0.0005 inches to enable accurate counter bore, counter sink and blind via drilling. The CNC-7PC control provides backward compatibility with earlier Excellon systems.
Brigitte Lawrence, president, relayed: “Brigitflex has paid attention to its customer base. We are always experimenting with new materials and upgrades for the ever-changing world we are part of. With the addition of the 154L we will not only have greater technical capability but we significantly increase our capacity for your needs now and in the future. Please give us call for your concepts, proto into production printed circuit boards. We can work with all materials plus thin film lamination in house. We work with a 60-inch-wide etcher. We can think outside the box!”
Mike Sparidaens, vice president of sales at Excellon, shared his comments: “Excellon welcomes Brigitflex into the next generation of drilling and fabrication with the new 154L drill router system. We look forward to further developing our partnership and many years of success.”
About Brigitflex
Woman owned and operated with over 40 years’ experience in PCB fabrication specializing in large circuit boards, antenna boards, and multilayers located in Elgin, Illinois. Visit www.brigitflex.com for more information.
About Excellon
Excellon, an employee-owned company, is recognized worldwide as a leader in installed PCB Drilling systems with products ranging from single and multiple station mechanical drilling machines to hybrid laser precision via formation and routing systems. See www.excellon.com for more.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.