The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
Emerging Technologies Take Center Stage at IPC Electronics Materials Forum
September 11, 2019 | IPCEstimated reading time: 2 minutes
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.
Geared toward engineers and managers that procure materials or seek an understanding of advancements in materials for the board, assembly, components and protective layers, the IPC Electronics Materials Forum will emphasize the emerging technologies that challenge the existing materials set. Interactive panels and networking opportunities will provide attendees an open forum to discuss solutions to challenges.
The Forum will feature a keynote by Lenora Clark, director, autonomous driving and safety technology for MacDermid Alpha Automotive, who will present insights into all aspects of electronics, uniting circuitry, semiconductor and assembly solutions to support future automotive market needs.
“You can envision many future technologies, but you cannot create them without materials and processes to manufacture them,” said Brook Sandy-Smith, technical conference program manager. “Emerging technologies that challenge our existing materials set will inform the developments needed for the future, and we have an impressive lineup of speakers, including Lenora Clark as our keynote, at IPC Electronics Materials Forum to lead the way.”
More than 20 companies will be represented at the Forum, including Continental Automotive Systems, Averatak, Calumet Electronics, Indium, Lockheed Martin and Raytheon, among others.
Topics to be presented include:
- Semi-additive processes for high density interconnect
- Additive textile manufacturing for electrical connections
- SIR test method for underfill reliability in automotive electronics
- Digitization of organic electronics information: Materials, manufacturing and devices
- Reliable and cost-effective nickel-free solutions for high-frequency/high-density applications
- Evaluation of PCB through hole plating, drill, and desmear quality for new laminate materials
- Trends and developments in electronic protection materials
For more information about the IPC Electronics Materials Forum or to register, click here.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,500 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.
LITEON Technology Reports Consolidated April Sales of NT$16.7 Billion, Up 25% YoY and 1% MoM
05/14/2026 | LITEON TechnologyLITEON Technology reported its April consolidated revenue of NT$16.7 billion, up 1% M-o-M and 25% Y-o-Y. Revenue growth was mainly driven by high-end server power systems for cloud and AI applications, high‑efficiency backup battery units (BBU), and opto-electronic semiconductors.
Key Tronic Posts Results for Q3 of Fiscal Year 2026
05/14/2026 | KeytronicFor the third quarter of fiscal year 2026, Key Tronic reported total revenue of $89.6 million, compared to $112.0 million in the same period of fiscal year 2025.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.