Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Universal's APL Shares AREA Consortium Research at SMTAI
September 12, 2019 | Universal Electronics Inc.Estimated reading time: 2 minutes
Universal Instruments’ Advanced Process Lab (APL) will be exhibiting on booth #1215 at the SMTA International 2019 Exhibition in Rosemont, Illinois, September 24–25. Experts from the APL will be on hand to discuss current and next-generation technology challenges with attendees. The APL will also present at multiple technical sessions on topics derived from the ongoing research of the APL’s Advanced Research in Electronics Assembly (AREA) Consortium during the four-day conference, taking place on September 22–26.
On Tuesday, September 24 at 2:00 p.m., as a component of Session MFX2: Reflow Challenges, Auburn University graduate research assistant for the APL’s AREA Consortium, Arvind Srinivasan Karthikeyan will present a paper, entitled "Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components" that explores the phenomenon of solder joint bridging in fine-pitch BGA components reflowed under vacuum.
On Thursday, September 26 at 1:00 p.m., as a component of Session LF3: Low Temperature Solder, Binghamton University graduate research assistant for the APL’s AREA Consortium, Faramarz Hadian will present a paper entitled "Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy." This paper examines the migration of Bi in Sn-Bi solder joints under prolonged current flow and the possible consequences on mechanical properties and joint reliability.
Also on Thursday, September 26, at 3:30 p.m., as a component of Session LF4: Lead-Free Reliability II, AREA Consortium Manager and SMTA Distinguished Speaker, Jim Wilcox will present a paper entitled "Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing." This paper will address the demand for Pb-free solder alloys that exhibit superior performance in harsh environments by examining the microstructural evolution of two different high-reliability solder alloys in both accelerated thermal cycling and accelerated thermal shock testing. Wilcox will also co-chair Session APT4: Wafer-Level Packaging on Wednesday, September 25.
“We’ve been presenting at SMTA International for many years and each year, it continues to evolve and get even better,” said APL Director, David Vicari. “It is the perfect forum to exchange leading-edge knowledge and ideas with the brightest people in our industry, as well as offering the opportunity to mingle with some of our closest friends—both old and new—in the electronics community. Every year, we learn something new that we can apply in our own research and business objectives and, hopefully, we help some of our peers at the show do the same.”
The two-day exhibition will host more than 170 companies representing every facet of the industry. The conference features 15 professional development courses, 120 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.