Universal's APL Shares AREA Consortium Research at SMTAI

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Universal Instruments’ Advanced Process Lab (APL) will be exhibiting on booth #1215 at the SMTA International 2019 Exhibition in Rosemont, Illinois, September 24–25. Experts from the APL will be on hand to discuss current and next-generation technology challenges with attendees. The APL will also present at multiple technical sessions on topics derived from the ongoing research of the APL’s Advanced Research in Electronics Assembly (AREA) Consortium during the four-day conference, taking place on September 22–26.

On Tuesday, September 24 at 2:00 p.m., as a component of Session MFX2: Reflow Challenges, Auburn University graduate research assistant for the APL’s AREA Consortium, Arvind Srinivasan Karthikeyan will present a paper, entitled "Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components" that explores the phenomenon of solder joint bridging in fine-pitch BGA components reflowed under vacuum.

On Thursday, September 26 at 1:00 p.m., as a component of Session LF3: Low Temperature Solder, Binghamton University graduate research assistant for the APL’s AREA Consortium, Faramarz Hadian will present a paper entitled "Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy." This paper examines the migration of Bi in Sn-Bi solder joints under prolonged current flow and the possible consequences on mechanical properties and joint reliability.

Also on Thursday, September 26, at 3:30 p.m., as a component of Session LF4: Lead-Free Reliability II, AREA Consortium Manager and SMTA Distinguished Speaker, Jim Wilcox will present a paper entitled "Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing." This paper will address the demand for Pb-free solder alloys that exhibit superior performance in harsh environments by examining the microstructural evolution of two different high-reliability solder alloys in both accelerated thermal cycling and accelerated thermal shock testing. Wilcox will also co-chair Session APT4: Wafer-Level Packaging on Wednesday, September 25.

“We’ve been presenting at SMTA International for many years and each year, it continues to evolve and get even better,” said APL Director, David Vicari. “It is the perfect forum to exchange leading-edge knowledge and ideas with the brightest people in our industry, as well as offering the opportunity to mingle with some of our closest friends—both old and new—in the electronics community. Every year, we learn something new that we can apply in our own research and business objectives and, hopefully, we help some of our peers at the show do the same.”

The two-day exhibition will host more than 170 companies representing every facet of the industry. The conference features 15 professional development courses, 120 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.