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September 2019 Issue of PCB007 Magazine Available Now
September 17, 2019 | I-Connect007Estimated reading time: Less than a minute

In this month's issue of PCB007 Magazine, we look into why the flag standard became the symbol of the “rule of law” and a rallying point. It’s no small wonder, then, that the term was expanded to include other contracts that function as the rule of law by mutual agreement. The standards (documents) we discuss in this issue could be considered rallying points for those who support the intent of the standard and serve as our rule of law.
This September 2019 issue of PCB007 Magazine is now on the virtual newsstand, and available for delivery in your e-mailbox each month.
Subscribe through your my I-Connect007 membership.
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Sweeney Ng - CEE PCBSuggested Items
The Right Approach: Get Ready for ISO 9001 Version 6
09/10/2025 | Steve Williams -- Column: The Right ApproachWe are well past the normal five to seven years that a new revision of the ISO 9001 international quality standard gets released. It may be finished toward the end of 2025, with implementation starting in 2026, and there will be as many significant changes as we saw in the current 2015 version.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.