Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
Meet Dana Korf, I-Connect007 Columnist
September 20, 2019 | I-Connect007Estimated reading time: Less than a minute
Meet Dana Korf, one of our newest I-Connect007 columnists! Dana’s columns will focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Currently the principal consultant at Korf Consultancy LLC, Dana Korf works with companies to improve PCB fabricator front-end engineering processes. He also works with OEMs and ODMs to create design rules and technology roadmaps, assist with supplier selection/qualification, and reduce DFM cycles. Dana previously worked in China for over seven years at Multek in Zhuhai as senior director of manufacturing engineering and NPI and at Huawei Technologies in Shenzhen as director of PCB technology where he was responsible for PCB technology ranging from mobile phones to RF antennas, base stations, and high-speed digital servers and switches; before that, he worked for Samina-SCI, HADCO, and Zycon as director of product engineering. He has been awarded the IPC President’s Award, chaired many high-speed IPC committees, and was a co-chair for the iNEMI Data Convergence project, which has become IPC-2581. Dana graduated from Washington State University with a BSEE, and he enjoys following college and professional football and golf.
Read "Dana on Data" in Design007 Week Newsletter. Subscribe today!
Share on:
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
04/30/2025 | ElephantechJapanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing.
Safran Invests in mirSense, a French Startup Pioneering Quantum-cascade Lasers
04/30/2025 | SafranSafran, through its Safran Corporate Ventures investment subsidiary, has invested in mirSense, a French startup specializing in quantum-cascade lasers (QCLs).