-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Transition Automation (TA) Launches Articulating Paste Retainer Design for Squeegee Holder System
September 19, 2019 | Transition Automation (TA)Estimated reading time: 1 minute

Transition Automation, Inc. announces the launch of a fourth generation paste retainer design, one that incorporates new features and functions for SMT printing users. These paste retainers are an important part of the SMT squeegee that serves to keep the solder paste within the printing area of the stencil. This new design gives users full adjustability, both up-down positions and left-right positions, and also enables users to quickly loosen and remove the paste retainer to allow easier cleaning during product changeover.
This new patent-pending design features a parallel leaf spring configuration that provides a gentle degree of freedom, with a soft spring load in the Z direction that allows the paste retainer to ride close to the stencil, or in contact with the stencil without causing damage to or coining of the foil. The leaf spring design holds the paste retainer in a rigid vertical orientation which provides maximum damming function to keep the solder paste in the print area. This helps users minimize process interruption to reposition solder paste into the print area and also improves the solder paste quality by minimizing leakage of idle solder paste from the print area and consequently drying while idle.
These paste retainers are available and are being shipped immediately with all holder orders and may be installed on any prior Transition Automation holder system which has the T-slot configuration. For back retrofit, the part number is: PLX-PR-DT and the price is: $95 USD ea. For future holder orders they are included at no charge.
Transition Automation Permalex squeegee blades and holder systems are designed for high performance longevity for mission critical electronics production. These products are used worldwide for aerospace, automotive, communications, industrial control, government and satellite systems. Transition Automation, Inc. enhances electronics manufacturing production yield and efficiency by reducing machine interruption while maintaining high performance output for lengthy production cycles. The company strives for production consistency between orders, and across various machine platforms and squeegee styles.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.