-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Transition Automation (TA) Launches Articulating Paste Retainer Design for Squeegee Holder System
September 19, 2019 | Transition Automation (TA)Estimated reading time: 1 minute

Transition Automation, Inc. announces the launch of a fourth generation paste retainer design, one that incorporates new features and functions for SMT printing users. These paste retainers are an important part of the SMT squeegee that serves to keep the solder paste within the printing area of the stencil. This new design gives users full adjustability, both up-down positions and left-right positions, and also enables users to quickly loosen and remove the paste retainer to allow easier cleaning during product changeover.
This new patent-pending design features a parallel leaf spring configuration that provides a gentle degree of freedom, with a soft spring load in the Z direction that allows the paste retainer to ride close to the stencil, or in contact with the stencil without causing damage to or coining of the foil. The leaf spring design holds the paste retainer in a rigid vertical orientation which provides maximum damming function to keep the solder paste in the print area. This helps users minimize process interruption to reposition solder paste into the print area and also improves the solder paste quality by minimizing leakage of idle solder paste from the print area and consequently drying while idle.
These paste retainers are available and are being shipped immediately with all holder orders and may be installed on any prior Transition Automation holder system which has the T-slot configuration. For back retrofit, the part number is: PLX-PR-DT and the price is: $95 USD ea. For future holder orders they are included at no charge.
Transition Automation Permalex squeegee blades and holder systems are designed for high performance longevity for mission critical electronics production. These products are used worldwide for aerospace, automotive, communications, industrial control, government and satellite systems. Transition Automation, Inc. enhances electronics manufacturing production yield and efficiency by reducing machine interruption while maintaining high performance output for lengthy production cycles. The company strives for production consistency between orders, and across various machine platforms and squeegee styles.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.