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07/22/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
When I first published this column in 2020, the Joint All-Domain Command and Control (JADC2) was hot news in defense circles, but when was the last time you heard about it? You’re probably thinking, “There goes another defense program that fell by the wayside.” However, that’s not true. As JADC2 continues to develop, the need for rapid communication between soldiers, sensors, radars, computers, and weapon systems is greater than ever.

Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand

07/17/2025 | Markus Voeltz -- Column: Global PCB Connections
If you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.

IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell

06/22/2025 | Marcy LaRont, I-Connect007
Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.

Breaking Down Barriers: The Connectivity of Machines in SMT Production Lines

05/14/2025 | Bill Cardoso, Creative Electron
As the world increasingly moves toward erecting trade barriers, we find ourselves in a paradox. Across the globe, the rise in tariffs and protectionist policies is creating a more fragmented global economy, with nations seeking to insulate themselves from external economic pressures. However, within the confines of the SMT production line, the trend is moving in precisely the opposite direction—toward greater connectivity, integration, and collaboration. Rather than isolating one machine from another, SMT production lines are increasingly interconnected, with data being shared across various stages of the process to improve quality, efficiency, and defect detection.

U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B

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TrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.
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