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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Real Time with... SMTAI 2019 Videos Now Live
September 25, 2019 | I-Connect007Estimated reading time: Less than a minute
The SMTA International 2019 Conference and Exhibition is underway, and I-Connect007 is in Rosemont, Illinois, bringing you complete coverage of this annual event. If you couldn't make it to the show, be sure to catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!
Visit Real Time with... SMTAI 2019 to watch our video coverage and view our expansive—and expanding—photo gallery of images captured throughout the exhibition floor.
Suggested Items
U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B
03/05/2025 | TrendForceTrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.
Beyond Silicon: Exploring New Materials for Photonic Integrated Circuits
03/03/2025 | IDTechExPhotonic Integrated Circuits (PICs) use manufacturing processes developed for the semiconductor industry to miniaturize complex optical functionality onto a chip. PICs offer significant advantages over electronic ICs. Since light travels around 3X faster than electricity, PICs can transmit data with much higher throughput.
Geopolitics Reshapes the Global PCB Landscape as Trump 2.0 Looms
02/06/2025 | TPCAThe global PCB industry is undergoing a period of significant transformation driven by geopolitical shifts, protectionism, and supply chain restructuring.
Building on DesignCon’s 30th Anniversary Momentum
02/04/2025 | Marcy LaRont, I-Connect007With three decades of technological advancements, DesignCon has established itself as a premier conference for electronics design. Susan Deffree, the group event coordinator, reflects on the event's rich history and the exciting developments for its 30th anniversary.
Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.