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Advanced Electronics Packaging Digest

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HANZA Shareholders Approve Long-Term Share Savings Program LTIP 2026

06/30/2026 | HANZA
The general meeting resolved, in accordance with the board of directors’ proposal, to adopt a long-term share savings program, LTIP 2026.

Matric Group First US Manufacturer to Deploy Panasonic NPM-GH SMT Tech

06/30/2026 | EINPresswire.com
Matric Group has made a major investment in advanced dual-lane surface-mount technology (SMT) manufacturing at its Seneca, Pennsylvania headquarters, expanding domestic capacity for high-reliability, high-mix electronics production.

2026 Electronics Day Design France Brings Together Europe's Electronics Design Community in Toulouse

06/29/2026 | Anastasia Ederer, Global Electronics Association
More than 120 participants gathered onsite in Toulouse, with an additional 20 joining online, for the 2026 Electronics Day Design France, organised by Global Electronics Association in collaboration with IPC Designers Council France.

Schweizer Electronic, Ascent Circuits Plan Strategic Indo-German PCB Cooperation

06/26/2026 | Schweizer Electronic AG
Schweizer Electronic AG and ILJIN Electronics (India) Pvt. Limited, part of the Amber Group, intend to enter into a strategic cooperation in the field of printed circuit boards.

Incap Slovakia Invests in Cleanroom Capability for Semiconductor Manufacturing

06/26/2026 | Incap
Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility to support growing customer demand for contamination-controlled assembly, particularly in semiconductor-related applications.
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