SMTA 2019 International Awards

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The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.

Members of Distinction Award Winners for 2019

Founders Award: Charles E. Bauer, Ph.D., TechLead Corporation

Member of Technical Distinction Award: Dudi Amir, Intel Corporation

Excellence in International Leadership Award: Ivan Romo, SMarTsol Technologies

Excellence in Leadership Award: Greg Kloiber, Ducommun

SMTA+ Corporate Award: Intel Corporation

Grant/Scholarship Winners for 2019 

Hutchins Grant: Benjamin Stewart, Georgia Institute of Technology

Stromberg Scholarship: Kim Porter, Lorain County Community College

2018 SMTA International Conference Award Winners: Rich Freiberger, Best of Conference Presentation

"The Role of Nickel in Solder Alloys, Part 2: The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates," Kazuhiro Nogita, The University of Queensland

Best of Proceedings Paper

First Place: "Alloy Composition and Thermal Fatigue of High-Reliability Pb-Free Solder Alloys," Richard Coyle, Ph. D., Nokia Bell Labs

Second Place: "Dissolution Rate of Specific Elements in SAC305 Solder," David Hillman, Collins Aerospace

Third Place: "The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages," Richard Coyle, Ph.D., Nokia Bell Labs

Best Student Paper

"Assessment of Second-Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique," Vishnu Reddy, Georgia Institute of Technology