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PVA to Show Conformal Coating Equipment at The Assembly Show
October 1, 2019 | PVAEstimated reading time: 1 minute
PVA will exhibit in booth #400 at The Assembly Show, scheduled to take place October 22-24, 2019 at the Donald E Stephens Convention Center in Rosemont, Illinois. The company will showcase the following equipment: Delta 8 with an MR2 and PV202K, Delta 8 with FCS300-ES, SJ100 and FC100-CF for film coating, as well as a 3D printer.
Designed for multiple applications, the Delta 8 System is flexible beyond conformal coating. The MR2 highlights the Delta 8’s fluid dispensing capabilities. The MR2 is a versatile servo-controlled rod dispenser for processing single or dual component chemistries requiring a high level of dosing accuracy.
The PV202K-TCM Metering System is a cost-effective meter mix system for dispensing two component thermally conductive materials that contain abrasive fillers. The system operates by metering material directly from disposable plastic cartridges via a linear drive. As the drive advances, material is positively displaced to the two-part dispense valve.
Experts from PVA will be on hand in the booth to answer any questions about dispensing and coating, as well as other application solutions in the PVA line-up such as coating inspection, optical bonding and curing ovens.
About PVA
PVA is a global supplier of conformal coating systems, innovative fluid dispensing solutions and precision valve technology. PVA’s customer driven solutions are utilized worldwide in industries ranging from solar, semiconductor packaging, printed circuit board assembly, medical device manufacturing, and consumer electronics. Throughout the changing global manufacturing landscape, PVA remains committed to providing our customers with exceptional products and industry-leading global support.
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12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.