Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
AIM’s Carlos Tafoya to Present at SMTA Guadalajara Expo & Tech Forum 2019
October 1, 2019 | AIMEstimated reading time: 1 minute
AIM Solder has announced that Carlos Tafoya, Technical Support Director, will present the white paper “Weak Organic Acids—Detection and Reliability Assessment” at SMTA Guadalajara, scheduled to take place on October 23-24, 2019 at Expo Guadalajara in Guadalajara, Jalisco, Mexico.
Weak Organic Acids (WOA) are a common component of no clean liquid flux. These acids provide the cleaning and etching capabilities required to prepare surfaces to accept solder. They are also a source of chemical contamination that can cause electrical and corrosive failures on circuit assemblies. The ability to assess the risk of flux residue after soldering in the production environment is a challenge for assemblers and flux manufacturers alike. In this study the accuracy of common residue extraction methods and a comparison of electrical and soldering performance of common WOAs are performed to illustrate the challenges associated with flux residue assessment as it relates to reliability.
AIM will also highlight its full line of advanced solder materials, including its award-winning REL61 and REL22 high reliability alloys and new cored wire solders, RX18 and CX18. To discover all of AIM’s products and services, visit the company at the SMTA Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico in Stand # 409 for more information and to speak with one of AIM’s knowledgeable staff members.
About Carlos Tafoya
Carlos Tafoya received his B.S. in Industrial Engineering from the University of Texas – El Paso. He joined AIM in 2005, bringing with him over two decades of experience in the electronics assembly industry. Carlos currently oversees AIM’s technical support teams based in USA, Canada, Mexico, South America, Europe, China and India.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.