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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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MacDermid Alpha Releases New Acid Copper Metallization Solution
October 1, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, announces the release of MacuSpec HT 300, a high throw DC acid copper metallization able to metallize through holes of 15:1 aspect ratio boards at production volumes. The HT 300 process offers excellent microdistribution at high current densities while avoiding the capital expense of pulse plating rectifiers. For fabricators looking to push the limits of their DC plating lines, it is an alternative to making the switch to more expensive pulse plating systems. The process is an excellent choice for through hole plating, conformal blind via plating, and pattern plating applications.
In addition to the high throw capabilities, MacuSpec HT 300 is analyzable by CVS and common analytical tools providing ease of control and trouble-free operation throughout the solution life. The MacuSpec HT 300 deposit exceeds copper metallization specifications required for multilayer PCBs including IPC TM-650 2.4.18—tensile strength greater than 36,000 PSI and elongation greater than 12% ensuring great thermal reliability and structural integrity.
Rich Bellemare, Director for Electrolytic Metallization, noted, “Customers all over the world are already switching their old DC plating chemistry to MacuSpec HT 300 to achieve higher technology capability, lower operating costs, and longer service life from their equipment. Many of these customers are also taking advantage of combining HT 300 with our world leading direct metallization systems to further improve the productivity and value of their plating operations. “
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
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