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MacDermid Alpha to Present at IMPACT-IAAC 2019 Conference
October 4, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions will be presenting a technical paper at the IMPACT-IAAC 2019 Conference, co-located with TPCA in Taipei, to be held October 23–25, 2019. The paper details some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization in devices such as smartphones and high-performance computing.
Maddux Sy, Applications Manager for the Metallization group, will be presenting “Copper Electroplating Processes For Advanced HDI Applications” October 24, 14:25–14:40. The paper will be presented in Session S18, Room 504c and covers two DC acid copper micro-via fill plating processes, one for advanced tenting process (ATP) and another for modified semi additive process (mSAP) with vertical continuous plating (VCP) applications. The paper covers a broad range of topics involving the challenges presented by the advanced metallization requirements for today’s most advanced PCBs, including SL-PCB, MSAP, and traditional IC substrate designs.
Maddux will also be accepting the Packaging Best Paper Award for the paper presented at the 2018 IMPACT conference titled, “Electroplating Processes for IC Substrates-Embedded Trace Plate, Via Fill and Through-Hole Fill.”
For the times and locations for these papers and general information on the conference, please visit http://www.impact.org.tw.
For more information on Mr. Sy’s paper, contact him at Maddux.Sy@MacDermidAlpha.com
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
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