Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
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Call for Papers: EIPC Winter Conference 2020
October 4, 2019 | EIPCEstimated reading time: Less than a minute
The European Institute for the PCB Community (EIPC) is inviting the industry to submit technical papers for presentation at the upcoming EIPC Winter Conference, which will be held February 13–14, 2020, in Rotterdam, Netherlands.
Papers are being sought on the following topics: business outlook, reliability and traceability, design and new technologies, and equipment evolution.
Deadlines for the submission of a one-page abstract is November 1, 2019, while the paper will be due on January 13, 2020.
Please send the abstract submission form to K. Smit-Westenberg at kwestenberg@eipc.org.
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