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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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AT&S and Chongqing University Collaborate on Research and Education
October 7, 2019 | AT&SEstimated reading time: 2 minutes
AT&S (Chongqing) Co., Ltd and the Chongqing University have signed a framework agreement of strategic cooperation on September 26. According to the agreement, both parties will collaborate on a range of academic and educational programs including internship programs targeting different majors, designed curriculums for the IC substrates industry, talents recruitment, joint R&D projects, continuing education cooperations and joint student exchange programs between Universities in Chongqing and in Austria. It represents a milestone for AT&S as a first high-end IC substrates manufacturer in China partnering with one of the universities affiliated to the Ministry of Education of China in research and education excellence.
Chen-Jiang Phua, CEO of AT&S Business Unit Mobile Devices and Substrates, commented: “The agreement represents a win-win partnership. AT&S will be able to leverage Chongqing University’s talented students and outstanding faculty for expertise in cutting-edge technologies. Chongqing University will benefit from AT&S’s long-standing R&D capabilities and its market and commercialization expertise as of one of the world’s leading HDI PCBs and IC substrates manufactures.”
According to Phua, AT&S (Chongqing) offers training ground on site for students from Chongqing University. In September, around 80 undergraduates with the major in Engineering & Applied Chemistry spent one week with AT&S and got practical exposure from experts of the company whom enriched their knowledge in the semiconductors related manufacturing industry. It is one of the ways for AT&S to help students to begin their careers as a professional and solve the talent shortage for this fast growing key industry.
“Chongqing University combines socio-economic vision, technological capabilities, and commitment to talent development in a very creative and rather unique way, and the cooperation is a reflection of our commitment to the intellectual and human potential of this distinguished institution. We are proud to be partnering with Chongqing University to pursue scientific leadership and research excellence. Our collaboration agreement lends strong support to the notion that Chongqing will become an international logistics hub and an engine of modern industrialization”, commented Andreas Gerstenmayer, CEO of AT&S.
Chongqing is an important production bases for AT&S worldwide. In this city, AT&S has established two state-of-the-art plants for fast growing semiconductor industry and advanced HDI since 2011. In July 2019, AT&S annouced to invest a further €1 billion Euros in Chongqing over the next five years on a new manufacturing facility for high-end IC substrates.
Chongqing University was founded in 1929. It is a key national university located in Chongqing. Among its various departments, Chongqing University is especially highly ranked in the Built Environment, Engineering, Technology and Business disciplines.
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Brent Fischthal - Koh YoungSuggested Items
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