-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
New Design Strategy Can Help Improve Layered Superconducting Materials
October 14, 2019 | Tokyo Metropolitan UniversityEstimated reading time: 2 minutes
Scientists from Tokyo Metropolitan University have created a new layered superconducting material with a conducting layer made of bismuth, silver, tin, sulfur and selenium. The conducting layer features four distinct sublayers; by introducing more elements, they were able to achieve unparalleled customizability and a higher "critical temperature" below which superconductivity is observed, a key objective of superconductor research. Their design strategy may be applied to engineer new and improved superconducting materials.
Once an academic curiosity, superconductors are now at the cutting edge of real technological innovations. Superconducting magnets are seen in everyday MRI machines, particle accelerators for medical treatments, not to mention the new Chuo Shinkansen maglev train connecting Tokyo to Nagoya currently being built. Recently, a whole new class of "layered" superconducting structures have been studied, consisting of alternate layers of superconducting and insulating two-dimensional crystalline layers. In particular, the customizability of the system has garnered particular interest in light of its potential to create ultra-efficient thermoelectric devices and a whole new class of "high temperature" superconducting materials.
A team led by Associate Professor Yoshikazu Mizuguchi from Tokyo Metropolitan University recently created a bismuth sulfide based layered superconductor; their work has already revealed novel thermoelectric properties and an elevated "critical temperature" below which superconductivity is observed. Now, working with a team from the University of Yamanashi, they have taken a multi-layered version of the system, where the conducting layer consists of four atomic layers, and begun swapping out small proportions of different atomic species to probe how the material changes.
Starting with a conducting layer made of bismuth, silver and sulfur, they tried substituting some of the silver for tin. By varying the amount of silver, they were able to raise the critical temperature from 0.5K to above 2.0K. Interestingly, they found that this was accompanied by the disappearance of an anomaly in its resistivity at significantly higher temperatures. Though the reason behind this is not yet understood, it is clear that the addition of tin has significantly modified the electronic structure of the material. Furthermore, they took their best bismuth, silver, sulfur and tin combination and substituted some of the sulfur for selenium, a modification known to improve superconducting properties in their original bismuth sulfide material. Not only did they raise the critical temperature further to 3.0K, they found that the response to magnetic fields showed signatures of "bulk" superconductivity, providing clear proof that they could in fact access both the advantages of reduced dimensionality and bulk materials.
By changing the composition and number of layers, the team believe they are on the verge of achieving bottom-up engineering of new, tailored bismuth sulfide based superconducting materials.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Unitemp Launches ESPEC Deep Capacity HAST Chamber in UK for Large PCB Testing
03/24/2026 | UnitempA new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.
SEEQC Unveils Integrated Qubit Control Quantum Chip
03/19/2026 | BUSINESS WIRESEEQC announced a significant breakthrough in the development of scalable, chip-based quantum computers, with results published in a peer-reviewed study in Nature Electronics.
Indium Corporation Experts to Present on Array of Solder and Thermal Management Solutions at APEX EXPO 2026
03/12/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX EXPO 2026, March 17-19, in Anaheim, California.
T-type Thermocouples in Foil Heater Technology
03/12/2026 | Zack Schaner, Flexible Circuit TechnologiesThis article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments