The Government Circuit: Fewer Hammers, More Scalpels—What Divided Government Means for U.S. Trade Policy
SMT Perspectives & Prospects: What I Hope the Next Generation Will Carry Forward
Learning With Leo: Observations from IPC Builds in Paris
I-Connect007 announces the latest episode of its Meet the Author podcast series, spotlighting Dr. Pritha Choudhury, a co-author of The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2. In this conversation with SMT007 Managing Editor Nolan Johnson, Dr. Choudhury explains why a second volume was essential and explores the real-world factors accelerating the adoption of low-temperature soldering across the electronics manufacturing industry.
Building on Volume 1, this next book dives deeper into materials, process windows, reliability tradeoffs, and line-integration strategies for low-temperature alloys. In this episode, Dr. Choudhury outlines the market and engineering dynamics behind the technology’s momentum, including energy savings, CO2 emissions reduction, cost savings, and sustainability alignment.
Listeners will gain practical insight into how assemblers can evaluate low-temperature options, qualify materials, and mitigate reliability risks while achieving measurable operational benefits.
Listen & Download
Download Volume 2
Download Volume 1
Listen to the podcast episode
About the Book
The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2 expands on essential principles for selecting and deploying low-temperature solders, with fresh data, case studies, and implementation guidance for production environments. It is designed for process engineers, manufacturing leaders, and technologists seeking to accelerate adoption while safeguarding reliability.
About the Meet the Author Podcast
I-Connect007’s Meet the Author podcast connects electronics manufacturing professionals with the experts behind I-Connect007’s popular technical book series.
