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The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
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Industry Experts at the SMTA Additive Electronics Conference
October 21, 2019 | I-Connect007Estimated reading time: Less than a minute
Why should you attend the SMTA Additive Electronics Conference: PCB Scale to IC Scale? To build your expertise with these expert speakers:
- Wilfried Bair, VP engineering, NextFlex
- Nathan Khosla, senior research scientist, Lockheed Martin
- Beth Paquette, flight systems design, NASA-GSFC
- Brian Hess, chemical/process engineer, Calumet Electronics
- Rahul Raut, director, strategy/tech. acq., MacDermid Alpha Electronics Solutions
- Bawa Singh, exec. VP, tech and corp. dev., MacDermid Alpha Electronics Solutions
- Steve Vetter, electronics engineer, Naval Surface Warfare Center, Crane
- Mike Vinson, president, Averatek
- Will Wallace, general manager, SAT Plating
Don’t miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.
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American Standard/Sunstone Circuits to Exhibit at the Northwest Electronics Design & Manufacturing Expo (NEDME) 2024
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