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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Meet Zulki Khan, SMT007 Columnist
October 25, 2019 | I-Connect007Estimated reading time: Less than a minute
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.
Zulki Khan is the founder and president of NexLogic Technologies Inc. in San Jose, California—an ISO 9001:2015 certified company, ISO 13485:2016 certified for medical electronics, and a RoHS compliant EMS provider. As a highly regarded PCB design, fabrication, and assembly company, NexLogic works and collaborates with leading OEMs and startups on their IoT and wearable device projects. The company’s design and assembly engineering staffs provide customers the necessary know-how, guidance, and expertise to resolve issues and allow OEMs to continue moving smoothly through challenging IoT projects.
Before starting NexLogic, Khan was general manager for Imagineering Inc. in Schaumburg, Illinois. He has also worked on high-speed PCB designs with signal integrity analysis. Khan holds a B.S. in electrical engineering from NED University of Engineering and Technology and an MBA from the University of Iowa.
Read “Zulki’s PCB Nuggets” in SMT007 Week Newsletter. Subscribe today!
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