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Nihon Superior Extends Soldering Iron Tip Life by 3X with New TipSave N
October 29, 2019 | Nihon Superior Co. LtdEstimated reading time: Less than a minute
Nihon Superior Co. Ltd., an advanced joining material supplier, introduces its new TipSave N flux-cored solder wire. The newly developed TipSave N flux-cored solder wire extends soldering iron tip life by 3X.
When a solder joint is made with a soldering iron, the tin reacts with the iron plating on the tip, gradually eroding it. Eventually the underlaying copper is exposed resulting in damage to the tip. TipSave N slows this erosion, extending the tip life and reducing the replacement cost of soldering tips. Paired with the (032) no-clean, halogen-free cored-flux, it provides fast wetting and low spattering. TipSave N is a good match for hand soldering as well as continuous robotic soldering as it reduces required soldering tip change overs, increasing production while reducing cost.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new solder pastes and lead-free products, visit www.nihonsuperior.co.jp/english.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.