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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/05/2026 | Marcy LaRont, I-Connect007
It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

SMT007 Magazine June Issue Focuses on Cleaning, Contamination Control, and Reliability

06/02/2026 | I-Connect007 Editorial Team
SMT007 Magazine’s June issue examines how cleaning processes, contamination control, and reliability engineering are evolving to support highly dense assemblies, advanced packaging, and next-generation electronics manufacturing.

Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer

06/03/2026 | Leo Lambert -- Column: Learning With Leo
I share this perspective based on my experience as a member of the United Nations Environment Programme (UNEP) Solvent, Coatings and Adhesives Technical Options Committee, which developed the report “Protecting the Ozone Layer” to inform policy decisions at the 1995 Meeting of the Parties to the Montreal Protocol in Nairobi. My involvement in this work dates back to 1976, when I joined Digital Equipment as an engineer supporting manufacturing operations, focusing on soldering and cleaning processes across global facilities.

Nolan’s Notes: Cleaning With Smaller Geometries

06/03/2026 | Nolan Johnson -- Column: Nolan's Notes
Cleaning is an under-appreciated, possibly under-considered step in the PCB assembly process. Smaller geometries, combined with increasingly larger bottom-terminated packages for complex components, using ever-smaller pitch sizes, mean that cleaning solutions must drive deeper and rinse out more easily than ever before, and must extract all flux residue and other contaminants.
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