GOWIN Semiconductor Releases First FPGA with Bluetooth Radio
November 12, 2019 | GOWIN SemiconductorEstimated reading time: 2 minutes
GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their latest mSoC FPGA with integrated Bluetooth 5.0 low-energy radio, enabling an entirely new wave of FPGA computing capabilities at the edge.
Edge computing is requiring new demands on programmable devices. With significant variances in product requirements, GOWIN is paving the way for innovation with a variety of new features integrated within their next-generation FPGAs. Their latest device called the GW1NRF-4 provides a 4k LUT FPGA, a 32-bit power-optimized ARC processor and a Bluetooth Low Energy radio all in a single 6x6mm QFN package. This enables product developers flexible IO for sensors, audio, camera and display interfaces, FPGA resources for parallel computing and acceleration, and a microcontroller for control, configuration, and power management.
“The market is requiring easily deployed connectivity for edge computing,” said Scott Casper, Director of Sales, Americas, GOWIN Semiconductor. “Once again, GOWIN is leading the response with our first RF solution. With this new device, embedded designers can wirelessly connect IoT devices to cloud gateways or other handheld devices via Bluetooth LE. In addition, deployed FPGAs can be programmed in the field through the Bluetooth LE connection, allowing system upgrades without the need for major maintenance expenses.”
Since power consumption is often a critical aspect of Bluetooth enabled devices, GOWIN’s GW1NRF-4 device includes a power management unit, which allows for various power modes along with a full chip disable feature to turn off the device while consuming only 5nA.
“Next-generation FPGA’s for edge applications can benefit tremendously from having power management” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “The GW1NRF-4 provides multiple power modes and the ability to power gate the FPGA fabric. This is great for Bluetooth Low Energy applications that are typically battery-powered.”
GOWIN will be hosting a webinar on Thursday, December 12, 2019 to showcase the new FPGA product. Sign up for the webinar at www.gowinsemi.com.
In addition, GOWIN will be demonstrating their new programmable device at various conferences including ICCAD 2019, ET & IoT Technology 2019 and Embedded World 2020. The demonstration shows basic BLE device connectivity to a smartphone on their latest FPGA Bluetooth module and development kit.
About GOWIN Semiconductor Corp.
Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.