Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
EMA Webinar Nov. 20: What’s New in OrCAD/Allegro 17.4?
November 14, 2019 | EMA Design AutomationEstimated reading time: Less than a minute
Get a first look at what’s new in the latest release. With a singular focus on improving your design experience and productivity, this release provides a host of new capabilities and enhancements you need to see.
Join EMA Design Automation on Wednesday, November 20, 2019 from 2 – 3 PM EST for a live “what’s new” session and get a chance to pose questions to a team of PCB and Cadence experts.
See what’s new in the OrCAD/Allegro 2019 17.4 release including:
- How to customize and streamline your design environment
- New one-click ECO process
- How to leverage real-time design feedback at the schematic level
- Intro to the new Unified Search Engine
- A new paradigm for ECAD MCAD collaboration
- Enhanced 3D in the PCB canvas for accurate and fast 3D design analysis and review
- In-design analysis for real-time modeless display of critical design data such as impedance discontinuities and coupling issues
- Enhanced routing capabilities to make your life easier and help speed routing and design closure
To register, click here.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in