Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator

05/18/2026 | Siemens
Siemens has announced that H2 Core Systems, a startup focused on modular hydrogen-based energy systems, is using the Siemens Xcelerator platform of software and automation portfolio to design and manufacture compact, highly efficient hydrogen energy systems that generate and store clean energy where it is needed.

Signal Integrity Meets Additive Innovation in the Latest Issue

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability

05/14/2026 | I-Connect007
I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.

Siemens Expands EDA Software Access Through EuroCDP Project

05/14/2026 | Siemens
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.

Rethinking Stackup, Materials, and Tolerances in Modern Designs

05/18/2026 | Kristin Moyer, Global Electronics Association
The simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in