Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Miniaturization Continues: Day 3 productronica Coverage
November 15, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The conversations on day 3 of productronica continued, including topics such as flexibility, 5G capabilities, and increased data and intelligence. The theme from test and inspection equipment providers included increased capabilities in sensing, material handling, and visual inspection technologies. And through it all, one common perspective emerged time and time again: PCB manufacturing is now approaching the levels of line, trace, and component density that were once limited to the surface of a silicon wafer.
What was once a level of precision relegated to the smooth, mirror-like surface of a wafer slice and then sealed in a package, now is expected upon the relatively rough, uneven, and flexible surface of today’s newest materials. Organizations—equipment manufacturers, university research consortia, industry standards organizations, and more—are all collaborating to bring these capabilities to PCB fabrication.
On Thursday, I-Connect007 caught up with the likes of Isola, Koh Young, CyberOptics, ESI, PVA, Mirtec, Hitachi High-Tech, Indubond, Vayo Technology, Meyer Burger, Agfa, Polar, Rogers, and Orbotech. We also report on the IPC Hand Soldering World Championships, which concluded—with much excitement—Thursday afternoon. We will have coverage of the event and the awards ceremony soon.
One more day of productronica coverage still to come.
Share on:
Suggested Items
Advancing Aerospace Excellence: Emerald’s Medford Team Earns Space Addendum Certification
06/30/2025 | Emerald TechnologiesWe’re thrilled to announce a major achievement from our Medford, Oregon facility. Andy Abrigo has officially earned her credentials as a Certified IPC Trainer (CIT) under the IPC J-STD-001 Space Addendum, the leading industry standard for space and military-grade electronics manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.