-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Schmalz Launches 'Clever Automation Solutions' for Electronics Production
November 18, 2019 | SchmalzEstimated reading time: 1 minute

Vacuum specialist Schmalz has unveiled numerous “clever” solutions for the automated handling of delicate electronic components.
For example, gripping systems that reliably protect delicate components against electrostatic discharge.
Electrostatic charges and the resulting uncontrolled electrostatic discharge (ESD) produce irreversible damage to electronic components such as chips or printed-circuit boards.
To resolve this problem, Schmalz produces handling solutions especially for the electronics industry – for example, vacuum suction cups made of NBR-ESD.
The suction cups are made of a special dissipative material that reliably protects the delicate components from damage through safe and rapid electrostatic discharge.
Both flat and bellows suction cups are available with different geometries and dimensions.
The ejectors are not only very small and powerful, but are also available in various designs and are suitable for mounting on blocks as a terminal.
Special variants are also suitable for use in combination with an external vacuum supply.
The spring plunger FSTIm is also designed for handling tasks in the electronics industry. It ensures gentle handling of delicate workpieces and is available in an electrically conductive version, says Schmalz.
In addition, Schmalz produces the flow grippers SCG and SCGS for secure gripping of printed-circuit boards and other electronic components. Both versions can be equipped with different suction cups, which are optionally available in NBR-ESD.
As a result, electrostatic discharges can be reliably prevented. The vacuum suction cup SUF is recommended for flat workpieces. This is suitable for universal use due to the variety of material options and also comes in a conductive version, says Schmalz.
Schmalz also presents the new addition to its range of electrical vacuum generators, the compact CobotPump ECBPM.
The device is specially designed for the automated handling of small parts with a single suction cup and is suitable for use on collaborative robots with a lift capacity of up to three kilograms.
The vacuum is entirely produced by electrical power and uses no compressed air. As a result, there is no need for conventional hoses, which makes it much easier to use in mobile robotics in particular.
Suggested Items
New Cryostatic Systems Elevate Current Research on Qubits
03/31/2025 | Fraunhofer IAFThe Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.
Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
03/28/2025 | ROHMMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform
03/27/2025 | PRNewswireAnsys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.
Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
03/27/2025 | Jerome Larez -- Column: Global PCB ConnectionsAs a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.