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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Mentor Video: What You Need to Know About Rigid-Flex DesignNovember 20, 2019 | Mentor, a Siemens business
Estimated reading time: Less than a minute
Rigid-flex technology is one of the fastest-growing areas in electronics product design.
From smart devices to sensors, to automotive and beyond, rigid-flex is now used in nearly every industry. Why? Because rigid-flex technology empowers electronics companies to meet today’s most challenging environment and form-factor requirements. Rigid-flex not only lets you create designs that are smaller, thinner and lighter, it improves product performance and reliability by eliminating mechanical connectors and cables.
This on-demand webinar will show you how PADS Professional's rigid-flex technology simplifies the rigid-flex design process, from stack-up definition through to manufacturing hand-off. The presenters are Technical Marketing Engineering Manager John McMillan and Technical Marketing Engineer Brent Klingforth, both of Mentor, a Siemens business.
What you will learn:
• Requirements for flex design
• When and where arced structures are required
• How to design a proper stack-up
• Automation specific to flex design
To watch this video, click here.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.
I-Connect007 is excited to announce the latest season of its popular podcast, On the Line With..., where industry experts share the latest insights and perspectives on the most relevant topics in the electronics industry. In this new season, “PCB 3.0: A New Design Methodology,” host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this first episode, Product Management Director Patrick Davis addresses the need for change.