The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
IPC Crowns Hand Soldering World Champion in Munich
November 21, 2019 | IPCEstimated reading time: 1 minute
IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.
Tasked with completing a very complex circuit board assembly with dozens of components, nearly 200 solder joints within a 60-minute time limit, and fully compliant with IPC Class 3 standards requirements, contestants faced a significant challenge.
Rising to the challenge, Indra Setiawan, PT SIIX EMS, Indonesia, completed the printed board assembly within 56 minutes, scored 321 points out of 340, and earned the title of IPC hand soldering world champion. In addition to his title, a cash prize of €1000, Setiawan received a soldering station from sponsors JBC Tools, HAKKO and Almit. Pauline Duval, Thalès DMS, France, took second place with a score of 318 points, and earned €500. Duval qualified for the championship just the day before by winning the regional competition. With a score of 316 points, third place and €300 went to Maricel Calabig Velasco, Integrated Micro-electronics Inc., Philippines.
“The competitors brought their best skills to meet the requirements of this year’s challenge,” said Philippe Léonard, director, IPC Europe. “It’s intricate work, especially as components keep getting smaller and smaller. This was a very challenging competition and we had a very talented field of competitors from around the world showcasing their skills.”
Assemblies were judged on soldering in accordance with IPC-A-610G Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. International MIT judges from China, Estonia, France, Holland and the United States provided their expertise judging the competition, and IPC thanks Patrick Mellet, IFTEC, France; Marcin Sudomir, Renex, Poland; Thomas Ahrens, Ph.D., Trainanlytics, Germany; Stefan Walls, PIEK, The Netherlands; Jack Shi, IPC Asia/Pacific; and Johnson Stephen Muriel, IPC Asia/Pacific.
In addition, IPC thanks 2019 Hand Soldering World Championship Gold sponsors JBC Tools, HAKKO, Reeco and Thalès and Silver sponsors Optilia, The Daylight Company, Almit, NCAB and Zestron for their enthusiastic support this year.
For information on upcoming IPC Hand Soldering Competitions, visit www.ipc.org/events.
Check out I-Connect007's video coverage of the IPC hand soldering competition in Munich.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.