Autotalks Launches First FIPS-Compliant C-V2X/DSRC Chipset for Secure US Deployment
December 2, 2019 | AutotalksEstimated reading time: 1 minute
Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, announced that its 2nd generation chipsets are FIP-certified for secure C-V2X or DSRC deployment in the US. The announcement comes after Autotalks’ V2X chipsets achieved Federal Information Processing Standard 140-2 (FIPS 140-2) security level 3 certification from the US National Institute of Standards and Technology (NIST).
Autotalks’ CRATON2 and SECTON embedded Hardware Security Module (eHSM) is the first V2X HSM to achieve this certification. FIPS 140-2 is a US government computer security standard that is used to approve cryptographic modules. The US Department of Transportation strongly urges FIPS 140-2 level 3 certification for V2X HSM in order to prevent the theft of security credentials.
“This makes Autotalks chipsets the only truly secure C-V2X/DSRC chipsets which are ready for deployment in the US,” said Yaniv Sulkes, Autotalks’ VP of Business Development and Marketing in North America and Europe. “In the midst of regulatory uncertainty about V2X technology and spectrum in the US, our solution allows automakers to deploy Autotalks’ secure V2X chipset using either V2X technology, with the option to later change to another technology, thus eliminating risk of wrong technology selection.”
Autotalks’ chipset isolates V2X from the non-safety domains, thus providing domain separation & security, scalability, and cost-optimizations of Telematic Control Unit (TCU) deployments. The embedded HSM exceeds the secure storage size defined by US DOT V2X NPRM, assures access to secure assets only by authorized processes and includes crypto-agility for future-proof cyber defense. The isolation of V2X, combined with Autotalks’ recognized cybersecurity leadership, enables a truly secure platform.
Autotalks chipsets are awarded for mass production DSRC and C-V2X projects by global OEMs and Tier 1 firms.
About Autotalks
Autotalks (www.auto-talks.com) is a V2X chipset market pioneer and leader, providing customers worldwide with state-of-the-art V2X solutions. Autotalks helps reduce collisions on roadways and improve mobility with its automotive qualified chipsets. The chipsets offer the most advanced, truly secure and highest performing global V2X communication solution designed for autonomous vehicles. Autotalks’ advanced technology, to be mass deployed in the coming years, complements the information coming from other sensors, specifically in non-line-of-sight scenarios, rough weather, or poor lighting conditions. It significantly improves overall road safety, effectively coordinating vehicles, self-driving cars, motorcyclists and pedestrians.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
05/01/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.