Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

U.S. Army Awards Lockheed Martin Contract to Increase PAC-3 MSE Production Capacity

11/14/2024 | Lockheed Martin
The U.S. Army recently awarded Lockheed Martin (NYSE: LMT) a contract to support increasing production capacity to 650 Patriot Advanced Capability – 3 (PAC-3®) Missile Segment Enhancements (MSEs)per year.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum

11/14/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.

NetVia Group Invests in KLA's Frontline InCAM Pro Software

11/14/2024 | Epec
NetVia Group, a leading provider of advanced printed circuit boards (PCBs) and solutions for high-reliability industries, proudly announces its investment in and implementation of Frontline InCAM® Pro software.

TI Accelerates Delivery to European Customers; Opens New Product Distribution Center Near Frankfurt, Germany

11/14/2024 | Texas Instruments
Texas Instruments (TI) announced the opening of its new, state-of-the-art product distribution center in Dreieich, Germany, outside of Frankfurt.

International Electronics Circuit Exhibition (Shenzhen) Coming Dec. 4–6

11/14/2024 | Edy Yu, I-Connect007
HKPCA hosts the 22nd annual International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show), Dec. 4-6, at the Shenzhen International Convention and Exhibition Center (Bao’an) in Halls 5, 6, 7, and 8. With more than 600 global brands and emerging companies, it is one of the world's largest gatherings for the circuit board and electronic assembly industry. The theme of the event is "AI Powers the Future." It will focus on AI, high-end PCBs, high-performance materials, smart automation, and other hot topics. It will showcase innovative processes and technologies across the PCB and PCBA industry chain, bringing together global elites and resources to drive ongoing development.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in