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Advanced Electronic Packaging: The Industry's New Innovation Engine

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Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

08/13/2026 | Chetan Arvind Patil, Marvell Technology
For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

Lam Research, NY CREATES Partner to Train Future Semiconductor Workforce

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Lam Research Corp. and New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY Creates) announced a collaboration to enable the training of approximately 3,500 students in semiconductor process integration over the next five years.

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation

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The European Semiconductor Industry Association (ESIA) announced that strong momentum in global semiconductor sales continued into the second quarter of 2026, with worldwide sales surging 123.6% year over year (YoY) to US$403.3 billion.
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