-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Estimated reading time: 2 minutes

Fresh PCB Concepts: Designing a PCB for Telecom Applications
We receive many questions about design guidelines based on the end-user application of PCBs. In this column, we will discuss PCBs for telecommunication applications. How do you design a telecom PCB? How are PCBs for telecom manufactured? What are the material considerations for a telecom PCB? We will also address what is needed for these products to work properly, and how manufacturing a PCB with the correct design guidelines will aid in achieving the desired final application. Here are a few key factors to consider. We also recommend involving your PCB supplier at the time of design to help ensure manufacturability at the lowest possible cost.
Design Considerations
First, let’s discuss the different design considerations for telecom applications based on the environment in which they will be used. Typical uses for telecom applications are indoor equipment, outdoor equipment, and terminal equipment. Each of these uses brings its own set of challenges, which should be considered from design through manufacturing. Table 1 shows some important design considerations.
Equipment | Application Requirements |
Indoor | • 24/7/365 demand and high reliability (99.999% availability) • High-density calculation • Heat and power dissipation design • High-speed circuit, high-density IC circuit • Hot-swap, which is replacing or fitting a part with the power still connected • Shockproof |
Outdoor | • 24/7/365 demand and high reliability (99.999% availability) • High RF power, electromagnetic compatibility, and radiation • 5x "anti-proof" = waterproof, dustproof, anti-vibration, lightning-proof, and salt-proof • Hot-swap, which makes it easy to maintain and manage voltage fluctuations • High and low temperature/high and low %RH (25%~60%) |
Terminal | • Built-in antenna, high-frequency, multi-band, high-sensitivity requirements • High-density, thermal management, power-saving design • Easy to install, maintain, and detect • Support alternative chip • Multiple man-machine interface and high-reliability requirements • Drop-proof, waterproof, manage voltage fluctuations, etc. |
Table 1: Design considerations.
Material Considerations
Choosing the correct material significantly affects the performance of the product’s required parameters. Here are a few things to consider when selecting materials:
- High-speed (SFP-CN 10G, DDR3 1600MT/s, XGMI 3.125G) ± 48V and 10A current
- Max rate is 10G in the case: Tg 170 and low loss are acceptable
- This mainly considers the length of the trace of the highest speed signal
- If the length of the trace ≤ 152 mm, then use these materials: S1000-2, S7038, and TU-872SLK
- If the length of the trace ≥ 152 mm, then use these materials: FR408HR and Megtron-4/M
- Thermal reliability, low-loss
It’s necessary to consider the layer counts and whether the material can support multiple lamination processes. Table 2 is a good resource to aid in material selection.
Low-Loss | S7439 | SYST | 200 (DMA) | 3.8 | 0.0045 |
S7038 | SYST | 190 | 3.8 | 0.007 | |
Megtron-4 | Panasonic | 176 | 3.8 | 0.005 | |
Megtron-4S | Panasonic | 200 | 3.8 | 0.005 | |
Megtron-M | Panasonic | 195 | 3.9 | 0.005 | |
TU-872SLK | TUC | 200 | 4 | 0.008 | |
TU-872SLK SP | TUC | 200 | 3.6 | 0.006 | |
FR408 | ISOLA | 180 | 3.78 | 0.0112 | |
FR408HR | ISOLA | 200 | 3.69 | 0.091 | |
I-Speed | ISOLA | 180 | 3.6 | 0.0058 | |
N4000-13Series | NELCO | 210 | 3.4-3.7 | 0.008-0.009 |
Table 2: Material selection.
With multiple challenging operations—such as back drill of different depths, press-fit technology, and deep cavity milling—it is crucial that the factories used have strong process accuracy and management capabilities. These are just some items to consider. We also recommend having deep discussion with your PCB supplier from the concept stage to ensure excellence and manufacturability are designed into the project.
Overall, when looking at PCBs for a telecom application, it is important to look at where that application will be used (indoor/outdoor/terminal equipment) and the types of materials that will give you the high-performance results required. The design should have considerations for signal integrity, thermal dissipation, and high power integrity.
Jeff Beauchamp and Harry Kennedy are field application engineers at NCAB Group.
More Columns from Fresh PCB Concepts
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBsFresh PCB Concepts: Traceability in PCB Design
Fresh PCB Concepts: Tariffs and the Importance of a Diverse Supply Chain
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
Fresh PCB Concepts: PCB Plating Process Overview
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
Fresh PCB Concepts: The Journey of a PCB—A Tale of Sustainability and Circularity