Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
SMA Connectors Offer Ruggedized Solution for Harsh Environments
December 16, 2019 | Amphenol RFEstimated reading time: 1 minute
Amphenol RF is pleased to introduce additional SMA connectors to the existing Amphenol Rugged Connector (ARC) series. This product series is specifically designed to offer superior performance in harsh conditions which makes them ideal for outdoor applications where extreme weather conditions may be a consideration. These interconnect solutions are rated IP67 in both the mated and unmated condition.
The new SMA connectors are constructed using nickel plating over brass to provide robust performance in less than optimal environments. These 50 ohm interconnects are available in straight and right angle configurations and operates with minimal reflection for the full range of the cable, DC to 8 GHz. The reliable threaded interface makes these ARC connectors ideal for outdoor installation.
The SMA ARC connectors are available as part of a pre-configured fixed length cable assembly featuring LMR-200 cable, designed and manufactured by Times Microwave, for a full Amphenol solution.
Amphenol RF is a leading manufacturer of coaxial connectors for use in radio frequency, microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has global sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions.
Share on:
Suggested Items
Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary
03/28/2025 | Zollner Elektronik AGIn a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.
FAA Certifies Airbus H125 IFR Capability
03/04/2025 | AirbusThe H125‘s single pilot instrument flight rules (IFR) capability has been certified by the U.S. Federal Aviation Administration (FAA), paving the way for first deliveries in 2025 from Airbus Helicopters’ assembly line in Columbus, Mississippi.
IBIDEN Announces Issuance of JPY 15 Billion Unsecured Bonds
08/30/2024 | IBIDENIBIDEN Co., Ltd., a leading manufacturer of advanced electronic materials, announced the issuance of JPY 15 billion (approximately USD 110 million*) in unsecured bonds.
Regulatory Review of Renesas’ Acquisition of Altium Concludes
07/02/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Altium Limited, a global leader in electronics design systems received notification from the Committee on Foreign Investment in the United States (CFIUS) on July 1, 2024 (PDT) that the investigation of the companies’ proposed merger transaction by way of a scheme of arrangement is complete and that there are no unresolved national security concerns with respect to the transaction.
KYZEN to Showcase Multi-Process Power Module Cleaner at SEMICON West 2024
06/10/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in SEMICON West 2024, taking place July 9–11 at the Moscone Center in San Francisco. KYZEN will be exhibiting in Booth 1841, where attendees will have the opportunity to learn about their latest advancements, including the spotlight product: MICRONOX® MX2123 Multi-Process Power Module Cleaner.