SMA Connectors Offer Ruggedized Solution for Harsh Environments
December 16, 2019 | Amphenol RFEstimated reading time: 1 minute
Amphenol RF is pleased to introduce additional SMA connectors to the existing Amphenol Rugged Connector (ARC) series. This product series is specifically designed to offer superior performance in harsh conditions which makes them ideal for outdoor applications where extreme weather conditions may be a consideration. These interconnect solutions are rated IP67 in both the mated and unmated condition.
The new SMA connectors are constructed using nickel plating over brass to provide robust performance in less than optimal environments. These 50 ohm interconnects are available in straight and right angle configurations and operates with minimal reflection for the full range of the cable, DC to 8 GHz. The reliable threaded interface makes these ARC connectors ideal for outdoor installation.
The SMA ARC connectors are available as part of a pre-configured fixed length cable assembly featuring LMR-200 cable, designed and manufactured by Times Microwave, for a full Amphenol solution.
Amphenol RF is a leading manufacturer of coaxial connectors for use in radio frequency, microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has global sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
SMTA's Electronics in Harsh Environments Conference Program Announced
03/27/2026 | SMTASMTA is proud to announce the 2026 Electronics in Harsh Environments Conference, taking place 19-21 May in Amsterdam, Netherlands.
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.
Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary
03/28/2025 | Zollner Elektronik AGIn a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.
FAA Certifies Airbus H125 IFR Capability
03/04/2025 | AirbusThe H125‘s single pilot instrument flight rules (IFR) capability has been certified by the U.S. Federal Aviation Administration (FAA), paving the way for first deliveries in 2025 from Airbus Helicopters’ assembly line in Columbus, Mississippi.
IBIDEN Announces Issuance of JPY 15 Billion Unsecured Bonds
08/30/2024 | IBIDENIBIDEN Co., Ltd., a leading manufacturer of advanced electronic materials, announced the issuance of JPY 15 billion (approximately USD 110 million*) in unsecured bonds.