Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
TopLine to Exhibit at Internepcon Japan January 15-17 2020
December 17, 2019 | TopLineEstimated reading time: 1 minute
TopLine will exhibit its innovative CCGA technology and daisy chain component solutions at Internepcon Japan from 15-17 January 2020 at the Tokyo Big Sight venue. Internepcon Japan is one of seven shows comprising NEPCON JAPAN 2020, the 34th Electronics R&D, Manufacturing and Packaging Technology Expo. TopLine will exhibit in Booth S4 – 17.
TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, and a quick chart of TopLine CCGA products, visit www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co.
In addition to CCGA solutions, TopLine also manufactures daisy chain test components, Zero Ohm PCB jumpers and engineering evaluation kits for experimentation. TopLine also makes vibration dampers to extend the life of PCB assemblies. These and other TopLine innovations will be on exhibit in the show booth. For more information about the show, visit www.nepconjapan.jp/en-gb/about/exhibits/internepcon-japan.html.
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
08/26/2025 | ZESTRONZESTRON, the global leader in high-precision cleaning solutions and services, is excited to announce the addition of a new capability in its Technical Center in Manassas, VA: