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Advanced Electronics Packaging Digest

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Suggested Items

TopLine to Exhibit CCGA Solutions at Space Tech Expo

05/22/2026 | TopLine
TopLine Corporation will exhibit its innovative electronic component solutions and solder column technology in booth #539 at the upcoming Space Tech Expo USA show at the Anaheim Convention Center, Anaheim, California, June 3 – 4, 2026.

Intuitive Machines Expands Integrated Space-to-Ground Network with Goonhilly Acquisition

05/21/2026 | Intuitive Machines
The massive Artemis II success, NASA’s Ignition Initiative, and rising commercial and national security interest in the Moon are driving demand for a space network capable of supporting sustained lunar missions and operations.

Voyager Awarded Subcontract by Redwire for DARPA Mission

05/21/2026 | BUSINESS WIRE
Voyager Technologies was awarded a subcontract by Redwire, the prime contractor for the DARPA Otter program, to supply its high-precision Acceleration Measurement System (AMS).

Teledyne Space Imaging Sensors Launch Aboard European Space Agency’s SMILE Mission

05/20/2026 | BUSINESS WIRE
Teledyne Space Imaging, a leading supplier of space-qualified imaging sensors, focal plane arrays and integrated camera systems, announced it supplied two CCD370 imaging sensors for the Soft X-ray Imager on the European Space Agency’s SMILE mission (Solar wind Magnetosphere Ionosphere Link Explorer).

BAE Systems Delivers Next-Generation Flight Hardware for U.S. Space Force Missile Warning Program

05/18/2026 | BAE Systems
BAE Systems has delivered the sensor subassembly and sensor system controller components for the Next Generation Overhead Persistent Infrared Polar (NGP) program.
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